ACC's process engineers work constantly to improve our manufacturing processes. Improvements range from selecting new manufacturing equipment to selecting solder with improved formulations.
- Continual Process Improvement
- Design for Manufacturability
- Design for Testability
- Manufacturing Process Selection
Ideally, we will have an opportunity to work with your design engineer before your printed circuit board is laid out. This allows us to discuss the basic board requirements that are included in the attached article called "Board Layout Information". If you are in the process of laying out a board, please read the following white papers.
We also welcome the opportunity to discuss ways in which your boards can be made less expensive to assemble and test. Please click on the following links.
When we receive a Request for Quotation (RFQ), we start with and evaluation of the Gerber files and sample boards you supply. This step reveals the processes required to build your product along with any special fixtures that may be required. Generally speaking, each process adds cost, and we will be happy to work with you to eliminate un-necessary steps in the manufacturing process.
Following are links to helpful technical information on other web sites.
IPC Standards - http://www.ipc.org/ContentPage.aspx?pageid=Standards
Surface Mount Technology Association - http://www.smta.org/index.cfm
SMT and SMD (Devices) - http://surfacemounttechnology.wordpress.com.